CSconnected SIPF WP3.2 Development scalable compound semiconductor solutions
06th August 2021
Development scalable compound semiconductor solutions for photonic, wireless and flexible photovoltaic applications.
Objectives: To address the semiconductor hardware demands of new technology trends by delivering a demonstration of a volume manufacture GaAs based fab capability.
- 3D sensing:
Partners: IQE, NWF, MicroChip , Swansea University, Cardiff University, Microlink Devices, CSA Catapult
The CSconnected SIPF Collaborative Research and Development (CRD) work packages (WP) address the CSconnected industry's partners priority opportunities for growth through collaboration and research.