Microchip Technology

Microchip Technology at Caldicot in South Wales, UK, has 40+ years of proven track record in developing and manufacturing next generation electronic modules. When size, performance and system integration are critical to your application, our technologies and miniaturization techniques can help make your products smaller, smarter and more reliable. We specialize in microelectronic assembly, miniaturization and integrated power electronics modules services. We supplement these services with our in-house design, substrate and testing capabilities. Our cutting-edge sub-assemblies are created using state-of-the art ECAD and MCAD simulation and design tools. We partner with you to provide world-class products that meet your specific Size, Weight and Power (SWaP) requirements. They are available as digital, mixed-signal, Radio Frequency (RF) and microwave assemblies in rigid and flex rigid substrates. Our embedded System-In-Package (SiP) technology for embedding components between PCB laminations allows you to reduce the size of your device or maintain its size while delivering additional functionality. Our pilot manufacturing line for high‑voltage silicon carbide (SiC) power modules, is capable of operating at up to 3.3 kV and currents exceeding 1,000 A. The line is supported by specialist low‑thermal‑resistance assembly equipment and advanced electrical and thermal simulation tools, creating an end‑to‑end workflow covering package development, assembly and validation. Microchip Technology Inc is a leading provider of microcontroller, analog, FPGA, and embedded control solutions offering high-reliability semiconductors and secure embedded solutions designed to meet rigorous industry standards. Our products are widely used in avionics, satellites, space exploration, radar systems, and military communication platforms, providing radiation-hardened components and long-term product support essential for mission-critical applications.